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The Effect of Anodization Parameters on the Aluminum Oxide Dielectric Layer of Thin-Film Transistors
Published on: May 24, 2020
ITZO-Based Self-Aligned Top Gate Thin-Film Transistor with Minimum Parasitic Capacitance for Long-Retention 2T0C DRAM
Jeong-Min Park1,2, Sein Lee1,2, Junseo Lee1,2
1School of Integrated Technology, Yonsei University, Seoul 03722, Republic of Korea.
Abstract:
We developed a two-transistor, zero-capacitor (2T0C) gain-cell memory featuring a self-aligned top-gate-structured thin-film transistor (TFT) for the first time. The proposed indium tin zinc oxide (ITZO) channel-incorporated architecture was specifically engineered to minimize parasitic capacitance for achieving long-retention 2T0C memory operations. A typical 2T0C structure features five types of parasitic capacitances; however, the proposed SATG design effectively used an essential gate insulator capacitance (C OX) and reduced four nonessential capacitances (C WBL-WWL, C WWL-SN, C RWL-SN, and C RBL-SN) to virtually zero. The ITZO-based 2T0C gain-cell memory achieved a retention time >10,000 s owing to the extremely low off-current (2.33 × 10-18 A/μm), superior positive-bias stability (0.71 V), and high saturation mobility [17.52 cm2/(V s)] of the optimized TFT structure. Our proposed memory with long retention and high endurance is a promising solution for next-generation 3D-integrated stacked dynamic random-access memories and defines a new structural standard for future memory architectures.
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