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Updated: Jun 1, 2025

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
High-Performance Edge-Contact Monolayer Molybdenum Disulfide Transistors
Jiankun Xiao1, Xiong Xiong1, Xinhang Shi2
1School of Integrated Circuits and Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing 100871, China.
Researchers developed high-performance edge-contact monolayer molybdenum disulfide (MoS2) field-effect transistors (FETs) using plasma etching. This technique significantly reduces contact resistance, enabling advanced 2D material electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Device Physics
Background:
- Edge contact is crucial for scaling down stacked nanosheet transistors with 2D channels.
- High edge-contact resistance currently limits the performance of 2D material devices.
Purpose of the Study:
- To develop high-performance edge-contact devices using monolayer 2D materials.
- To investigate the impact of plasma etching on edge-contact quality and device performance.
Main Methods:
- Utilized well-controlled plasma etching with pure argon on monolayer molybdenum disulfide (MoS2).
- Fabricated edge-contact monolayer MoS2 field-effect transistors (FETs).
- Evaluated device performance, including contact resistance and on-state characteristics, at various temperatures.
Main Results:
- Achieved a record-low contact resistance (Rc) of 1.25 kΩ·μm at cryogenic temperatures (20 K).
- Demonstrated good ohmic contact in edge-contact monolayer MoS2 FETs.
- Reported a record-high on-state current of 436 μA/μm and transconductance of 123 μS/μm for a 120 nm channel length device.
Conclusions:
- Plasma etching effectively improves edge-contact quality by addressing edge dangling bonds.
- The developed edge-contact technology shows great potential for high-performance monolayer transition metal dichalcogenide (TMD) electronics.
- This advancement paves the way for next-generation nanoscale electronic devices.
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