Range and accuracy of in-plane anisotropic thermal conductivity measurement using the laser-based Ångstrom method

High heat fluxes in electronic devices must be effectively dissipated to prevent local hotspots, which are critical for long-term device reliability. In particular, advanced semiconductor packaging trends toward thin form factor products increase the need for understanding and improving in-plane conduction heat spreading in anisotropic materials. The 2D laser-based Ångstrom method, an extension of traditional Ångstrom and lock-in thermography techniques, measures in-plane thermal properties of anisotropic sheet-like materials. This method uses non-contact infrared temperature mapping to measure the thermal response to periodic laser heating at the center of a suspended sample. The spatiotemporal temperature data are analyzed via an inverse fitting algorithm to extract thermal conductivities in the in-plane orthotropic directions that best adhere to the governing heat conduction equation. Using this algorithm, we present an approach to simultaneously fit data across multiple heating frequencies, which improves measurement sensitivity because the thermal penetration depth varies with frequency. The accuracy of this technique is assessed by tuning experimental parameters such as sample dimensions and heating frequency. A standardized workflow is proposed for measuring unknown materials and for processing the data, including filtering out regions influenced by laser absorption and heat sink boundary effects. Numerical simulations validate the method across a wide range of thermal conductivities (0.1-1000 W m-1 K-1) and material thicknesses (0.1-10 mm), with accuracy demonstrated for anisotropy ratios up to 1000:1. Experimental measurements on isotropic and anisotropic materials agree well with the benchmark values. Ultimately, standardization of this technique supports the development of engineered anisotropic heat-spreading materials for thermal management and packaging applications.