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Updated: May 31, 2025

Rendering SiO2/Si Surfaces Omniphobic by Carving Gas-Entrapping Microtextures Comprising Reentrant and Doubly Reentrant Cavities or Pillars
Published on: February 11, 2020
Single-Step Production of Doubly Re-entrant Microstructures Through Reaction-Diffusion Photolithography for
Hyung Han Bae1, Jong Bin Kim1, Hwan-Young Lee1
1Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea.
Abstract:
Omniphobic surfaces, which repel virtually any liquid regardless of its wettability, have been developed using doubly re-entrant microstructures. Although various microfabrication techniques have been explored, these often require multiple complex steps. In this study, reaction-diffusion photolithography (RDP) is used to fabricate micropost arrays with doubly re-entrant geometries through a single-step ultraviolet (UV) exposure process. To create a doubly re-entrant structure consisting of a central, elongated micropost topped with a short ridge, a photomask featuring a circular window surrounded by a narrow ring-shaped window is employed. This configuration is utilized in the RDP process, which relies on radical polymerization. Vertical growth of the structure from the photomask is achieved by introducing strong UV attenuation along the vertical axis, enabled by increasing the photoinitiator concentration. Concurrently, the growth of the ridge is slowed down by designing the ring window with minimal dimensions. This promotes rapid oxygen diffusion into the ring region, where the radicals generated by UV exposure are consumed through reactions with oxygen, thereby delaying the polymerization. This approach enables precise fabrication of full-length central microposts with short ridges in a single step. The resulting doubly re-entrant structures show high contact angles across various liquids and exhibit robust omniphobic performance.

