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Machining Path Optimization of Inductively Coupled Plasma Based on Surface Heat Transfer Model
Peiqi Jiao1,2,3, Bin Fan2, Qiang Xin2
1National Key Laboratory of Optical Field Manipulation Science and Technology, Chinese Academy of Sciences, Chengdu 610209, China.
Micromachines
|January 25, 2025
Summary
Inductively coupled plasma (ICP) processing of fused quartz faces thermal instability. A new staggered grating track effectively controls temperature, improving processing accuracy and enabling high-precision applications.
Area of Science:
- Materials Science
- Manufacturing Engineering
- Optical Engineering
Background:
- Inductively coupled plasma (ICP) is a non-contact optical processing method crucial for fused quartz preparation.
- Thermal effects during ICP processing lead to unstable removal rates and reduced accuracy, hindering advancements.
Purpose of the Study:
- To analyze critical temperatures affecting plasma removal depth.
- To establish a heat transfer model for plasma jet processing.
- To develop strategies for mitigating thermal effects in ICP machining.
Main Methods:
- Simulation of a heat transfer model for plasma jet processing.
- Derivation of the heat conduction equation.
- Analysis of grating track path temperatures.
- Proposal and verification of a staggered grating track.
Main Results:
- Identified critical temperatures and radii related to processing speed.
- Developed a heat transfer model and derived the heat conduction equation.
- Demonstrated that a staggered grating track effectively controls path temperature and suppresses processing errors.
Conclusions:
- Understanding heat transfer is key to improving ICP machining precision.
- The proposed staggered grating track offers a viable method for high-precision plasma machining path optimization.
