Updated: May 30, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Assia Hamada1, Yu Kyoung Ryu1,2, Andres Velasco1
1Instituto de Sistemas Optoelectrónicos y Microtecnología, Universidad Politécnica de Madrid, Av. Complutense 30, 28040 Madrid, Spain.
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