Abrasive Layer Cracking Analysis and Strength Evaluation of High-Speed Grinding Wheels

Area of Science:

• Materials Science
• Mechanical Engineering
• Manufacturing Processes

Background:

• High-speed grinding wheels require both effective grinding performance and user safety.
• A batch of resin-bonded high-speed grinding wheels exhibited abnormal cracking between the abrasive layer and substrate.
• Investigating the root cause of this cracking is crucial for ensuring product reliability and safety.

Purpose of the Study:

• To identify the cause of cracking in resin-bonded high-speed grinding wheels.
• To determine the critical bonding strength required for safe grinding wheel operation.
• To provide guidance for improving the design and manufacturing of safe grinding wheels.

Main Methods:

• Physical and chemical analyses including fracture observation, density, hardness, and energy spectrum analysis.
• Gas Chromatography-Mass Spectrometry (GC-MS), Fourier-Transform Infrared Spectroscopy (FTIR), Differential Scanning Calorimetry-Thermogravimetric Analysis (DSC-TGA), and viscosity tests on the adhesive.
• Tensile strength testing of old and new adhesives, and COMSOL simulation for bonding strength analysis.

Main Results:

• Analyses showed compact structure and uniform feeding, with no significant differences in hardness or foreign bodies.
• Adhesive analysis revealed reaction or volatilization of active ingredients, significantly reducing its properties.
• The failed batch's adhesive had a tensile strength of 11 MPa, far below the required 23.82 MPa minimum bonding strength.

Conclusions:

• The primary cause of grinding wheel cracking is the insufficient tensile strength of the aged adhesive.
• The adhesive's low strength cannot withstand the thermal stresses during the grinding wheel's forming and cooling processes.
• Findings offer crucial insights for material selection, quality control, and process optimization in high-speed grinding wheel manufacturing.