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Updated: May 28, 2025

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
Published on: January 17, 2017
Ryota Ohnishi1, Mikihiro Hayashi1
1Department of Life Science and Applied Chemistry, Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho Showa-ku Nagoya Aichi, 466-8555, Japan.
This study introduces a novel bond exchange method for polymer adhesion, activating it only at the interface. This technique enables strong adhesion between dissimilar polymers without inherent bond-exchange properties, offering a new adhesive approach.
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