Flexible Hybrid Integration Hall Angle Sensor Compatible with the CMOS Process.

Area of Science:

• Materials Science
• Electrical Engineering
• Sensor Technology

Background:

• Silicon-based Hall application-specific integrated circuit (ASIC) chips are widely used due to their success in electronic and sensor devices.
• Flexible electronics require robust sensor components capable of withstanding mechanical stress.

Purpose of the Study:

• To design, simulate, and test flexible hybrid integration angle sensors utilizing complementary metal-oxide-semiconductor (CMOS) technology.
• To evaluate the performance and stability of these sensors on a flexible substrate under mechanical strain.

Main Methods:

• Fabrication of Hall sensors on a 100 µm-thick flexible polyimide (PI) membrane.
• Design and simulation of the sensor integrated using CMOS technology.
• Testing sensor sensitivity and stability under various bending conditions (minimum radius 10 mm, 100 bending cycles).

Main Results:

• The flexible Hall sensors achieved a sensitivity of 0.205 V/mT.
• Sensor sensitivity remained stable after bending to a 10 mm radius.
• Consistent performance was observed over 100 bending cycles, demonstrating durability.

Conclusions:

• Flexible hybrid integration angle sensors manufactured using CMOS technology are viable for industrial applications.
• The developed sensors exhibit excellent mechanical stability and consistent performance, making them promising for flexible electronic and sensor devices.