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Metal-Semiconductor Junctions

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Design, Fabrication, and Experimental Characterization of Plasmonic Photoconductive Terahertz Emitters

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Published on: July 8, 2013

Plasmonic Hot-Carrier Engineering at Bimetallic Nanoparticle/Semiconductor Interfaces: A Computational Perspective.

Mani Mani¹, Kevin Mariandry², Uma V Ghorpade¹

¹School of Chemical Engineering, UNSW, Kensington, NSW, 2052, Australia.

Small (Weinheim an Der Bergstrasse, Germany)

|February 16, 2025

Summary

Designing bimetallic nanoparticles enhances plasmonic catalysis by improving hot-carrier separation at metal-semiconductor interfaces. This approach boosts the efficiency of solar energy conversion in catalytic applications.

Keywords:

bimetallic hot‐carrier transfer interface plasmonics time‐dependent density functional theory

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Area of Science:

Materials Science
Photocatalysis
Nanotechnology

Background:

Plasmonic catalysis utilizes noble metals (Ag, Au, Cu, Al) and semiconductors to drive redox reactions using sunlight.
Noble metals efficiently absorb solar energy due to strong cross-sections and tunable absorption peaks.
Improving hot-carrier separation and utilization at monometallic particle-semiconductor interfaces remains a challenge.

Purpose of the Study:

To explore computational methods for designing bimetallic nanoparticles for enhanced plasmonic catalysis.
To investigate the advantages of core-shell or core-satellite bimetallic structures coupled with semiconductors.
To enhance hot-carrier separation and reduce recombination at the metal-semiconductor interface.

Main Methods:

Focus on computational methods and recent studies.
Design of bimetallic particles (plasmonic core, non-plasmonic shell) on semiconductor interfaces.
Utilizing quantum-mechanical modeling and experimental techniques.

Main Results:

Bimetallic designs favorably modify the metal-semiconductor interface.
Introduction of a non-plasmonic metal layer enhances hot-carrier separation.
Prevention of rapid electron-hole recombination within the plasmonic metal is achieved.

Conclusions:

Careful design of bimetal/semiconductor configurations can control plasmonic hot-carrier generation and separation.
Optimizing non-plasmonic metal size and composition is crucial.
This approach promises more efficient plasmonic devices for catalysis.