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Published on: May 30, 2014
Quantized Inverse Design for Photonic Integrated Circuits
Frederik Schubert1, Yannik Mahlau1, Konrad Bethmann1
1Institute for Information Processing, Leibniz University, 30167 Hannover, Germany.
This study introduces a memory-efficient framework for designing photonic integrated circuits (PICs) using reverse-mode automatic differentiation. The method enables complex 3D multimaterial structures, overcoming computational challenges in PIC design.
Area of Science:
- Photonics and Computational Electromagnetics
- Integrated Circuit Design
- Materials Science and Engineering
Background:
- Photonic integrated circuit (PIC) inverse design faces significant computational memory challenges.
- Advanced fabrication techniques like two-photon polymerization (2PP) require more flexible optimization algorithms for multimaterial 3D structures.
- Existing methods struggle with complex constraints from novel fabrication processes.
Purpose of the Study:
- To develop a memory-efficient reverse-mode automatic differentiation framework for finite-difference time-domain (FDTD) simulations.
- To enable the design of complex, multimaterial 3D photonic structures using novel fabrication methods.
- To address computational limitations in the inverse design of PICs.
Main Methods:
- Implemented a memory-efficient reverse-mode automatic differentiation framework for FDTD simulations.
- Utilized straight-through gradient estimation to handle nondifferentiable shape parametrizations.
- Developed optimization algorithms capable of managing complex constraints from advanced fabrication processes.
Main Results:
- Successfully designed increasingly complex photonic structures to solve coupling problems in PICs.
- Demonstrated the framework's effectiveness in handling memory-intensive simulations.
- Validated the approach for creating 3D multimaterial structures with unique properties.
Conclusions:
- The proposed memory-efficient framework significantly advances PIC inverse design capabilities.
- The method facilitates the creation of complex photonic devices using novel fabrication techniques.
- This approach holds substantial potential for future PIC design and practical applications.
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