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Quantized Inverse Design for Photonic Integrated Circuits.

Frederik Schubert1, Yannik Mahlau1, Konrad Bethmann1

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Summary
This summary is machine-generated.

This study introduces a memory-efficient framework for designing photonic integrated circuits (PICs) using reverse-mode automatic differentiation. The method enables complex 3D multimaterial structures, overcoming computational challenges in PIC design.

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Area of Science:

  • Photonics and Computational Electromagnetics
  • Integrated Circuit Design
  • Materials Science and Engineering

Background:

  • Photonic integrated circuit (PIC) inverse design faces significant computational memory challenges.
  • Advanced fabrication techniques like two-photon polymerization (2PP) require more flexible optimization algorithms for multimaterial 3D structures.
  • Existing methods struggle with complex constraints from novel fabrication processes.

Purpose of the Study:

  • To develop a memory-efficient reverse-mode automatic differentiation framework for finite-difference time-domain (FDTD) simulations.
  • To enable the design of complex, multimaterial 3D photonic structures using novel fabrication methods.
  • To address computational limitations in the inverse design of PICs.

Main Methods:

  • Implemented a memory-efficient reverse-mode automatic differentiation framework for FDTD simulations.
  • Utilized straight-through gradient estimation to handle nondifferentiable shape parametrizations.
  • Developed optimization algorithms capable of managing complex constraints from advanced fabrication processes.

Main Results:

  • Successfully designed increasingly complex photonic structures to solve coupling problems in PICs.
  • Demonstrated the framework's effectiveness in handling memory-intensive simulations.
  • Validated the approach for creating 3D multimaterial structures with unique properties.

Conclusions:

  • The proposed memory-efficient framework significantly advances PIC inverse design capabilities.
  • The method facilitates the creation of complex photonic devices using novel fabrication techniques.
  • This approach holds substantial potential for future PIC design and practical applications.