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Updated: May 27, 2025

Carrier Lifetime Measurements in Semiconductors through the Microwave Photoconductivity Decay Method
Published on: April 18, 2019
Damage effects in GaN high electron mobility transistor power amplifier induced by high power microwave pulses
Jingtao Zhao1,2,3, Gang Zhao4,5,6, Quanyou Chen7
1Institute of Applied Electronics, China Academy of Engineering Physics, Mianyang, 621900, China. sduzjt@foxmail.com.
Abstract:
As the electromagnetic environment becomes increasingly complex and power density continues to increase, the reliability and safe operation of gallium nitride (GaN) high electron mobility transistors (HEMTs), which are widely used in the field of high-power radio frequency amplifiers, are severely jeopardized. In this study, the effects and mechanism of high-power microwave on AlGaN/GaN HEMT power amplifiers were explored. A novel effect phenomenon, which is entirely distinct from the reported high-power microwave damage mechanism of GaN devices, was uncovered. This phenomenon exhibits extremely strong field effect characteristics. Through further effect experiments and numerical simulations, it was affirmed that the failure mechanism is as follows: high-power microwave couples to the drain electrode, creating a high electric field, leading to avalanche breakdown near the gate and below the drain electrodes, forming a leakage channel. Subsequently, under the action of the device's bias voltage, extensive burning of the device occurs, which is a stimulating burnout effect.
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