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Related Concept Videos

Thermal Strain01:19

Thermal Strain

533
Thermal strain is a concept that arises when we consider how temperature changes affect structures. Unlike the conventional assumption that structures remain constant under load, real-world scenarios often involve temperature fluctuations that can significantly impact these structures. Consider a homogeneous rod with a uniform cross-section resting freely on a flat horizontal surface. If the rod's temperature increases, the rod elongates. This elongation is proportional to the temperature...
533
Transformation of Plane Strain01:12

Transformation of Plane Strain

151
When analyzing elongated structures like bars subjected to uniformly distributed loads, it is essential to understand the transformation of plane strain when coordinate axes are rotated. This transformation helps to assess how material deformation characteristics vary with orientation, which is crucial in materials science and structural engineering.
Under plane strain conditions, typical for members where one dimension significantly exceeds the others, deformations and resultant strains are...
151
Three-Dimensional Analysis of Strain01:29

Three-Dimensional Analysis of Strain

198
Three-dimensional strain analysis is crucial for understanding how materials deform under stress, particularly in elastic, homogeneous materials. This method employs principal stress axes to simplify complex stress states into more understandable forms. Subjected to stress, a small cubic element within a material either expands or contracts along these axes, transforming into a rectangular parallelepiped. This transformation effectively illustrates the material's deformation. The principal...
198
Relation between Poisson's ratio, Modulus of Elasticity and Modulus of Rigidity01:15

Relation between Poisson's ratio, Modulus of Elasticity and Modulus of Rigidity

240
Deformation occurs in axial and transverse directions when an axial load is applied to a slender bar. This deformation impacts the cubic element within the bar, transforming it into either a rectangular parallelepiped or a rhombus, contingent on its orientation. This transformation process induces shearing strain. Axial loading elicits both shearing and normal strains. Applying an axial load instigates equal normal and shearing stresses on elements oriented at a 45° angle to the load axis.
240
Shearing Strain01:20

Shearing Strain

201
The shearing strain represents a cubic element's angular change when subjected to shearing stress. This type of stress can transform a cube into an oblique parallelepiped without influencing normal strains. The cubic element experiences a significant transformation when exposed solely to shearing stress. Its shape alters from a perfect cube into a rhomboid, clearly demonstrating the effect of shearing strain. The degree of this strain is considered positive if it reduces the angle between...
201
Bending of Curved Members - Strain Analysis01:14

Bending of Curved Members - Strain Analysis

128
The mechanics of deformation in curved members, such as beams or arches, under bending moments, involve complex responses. When such a member, symmetric about the y-axis and shaped like a segment of a circle centered at point C, is subjected to equal and opposite forces, its curvature and surface lengths change significantly. This alteration results in the shift of the curvature's center from C to C', indicating a tighter curve.
The important part of bending analysis for such a member...
128

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Related Experiment Video

Updated: May 26, 2025

Applying Dynamic Strain on Thin Oxide Films Immobilized on a Pseudoelastic Nickel-Titanium Alloy
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Cooling-induced Strains in 2D Materials and Their Modulation via Interface Engineering.

Shichao Yang1, Xiaoxin Liang1, Wenwei Chen1

  • 1College of Materials Science and Engineering, Fuzhou University, Fuzhou, 350108, China.

Advanced Materials (Deerfield Beach, Fla.)
|February 21, 2025
PubMed
Summary

Cooling monolayer molybdenum diselenide (MoSe2) causes strain due to substrate mismatch. Encapsulation with hexagonal boron nitride reduces this strain, enabling new electronic properties for extreme temperature devices.

Keywords:
2D materialscoolinginterface engineeringstrainthermal expansion coefficients

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Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Nanotechnology

Background:

  • Two-dimensional (2D) materials offer unique electronic properties for advanced devices.
  • Their performance is sensitive to temperature, but cooling-induced strain effects are not well understood.
  • Monolayer molybdenum diselenide (MoSe2) is a key 2D material for electronic applications.

Purpose of the Study:

  • To systematically investigate the impact of cooling-induced strain on monolayer MoSe2 at cryogenic temperatures.
  • To understand how material-substrate interface engineering affects strain conditions.
  • To explore methods for mitigating strain in 2D materials for extreme temperature applications.

Main Methods:

  • Characterization of strain conditions at the 2D material-bulk substrate interface.
  • Photoluminescence (PL) spectroscopy to study optical emission changes.
  • Transient absorption spectroscopy to probe electronic transitions.
  • Encapsulation techniques using hexagonal boron nitride (hBN).

Main Results:

  • Thermal expansion mismatch between MoSe2 and substrates induces significant external strain.
  • Compressive strain leads to new emission features associated with a direct-to-indirect bandgap transition.
  • Hexagonal boron nitride encapsulation effectively mitigates external strain, mimicking suspended sample behavior.

Conclusions:

  • Cooling-induced strain significantly impacts 2D material properties, particularly bandgap transitions.
  • Engineering the 2D-bulk interface is crucial for controlling strain in cryogenic devices.
  • Encapsulation offers a viable strategy to manage strain and enhance the performance of 2D materials in extreme temperature environments.