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Updated: May 25, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Mechanical Characterization of a Novel Cyclic Olefin-Based Hot-Melt Adhesive
Vasco C M B Rodrigues1, Ana T F Venâncio1, Eduardo A S Marques2
1Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), 4200-465 Porto, Portugal.
Abstract:
A novel hot-melt cyclic olefin-based adhesive was designed as a transparent, non-tacky film of amorphous thermoplastic with a unique polymer micro-structure. The aim of the present paper is to assess the mechanical properties of the 0.1 mm thick COP hot-melt adhesive film through adhesive characterizations tests. The glass transition temperature was determined using dynamic mechanical analysis (DMA). For mechanical characterization, bulk and thick adherend shear specimens were manufactured and tested at a quasi-static rate, where at least three specimens were used to calculate the average and standard deviation values. Tensile tests revealed the effects of molecular chain drawing and reorientation before the onset of strain hardening. Thick adherend shear specimens were used to retrieve shear properties. Fracture behaviour was assessed with the double cantilever beam (DCB) test and end-notched flexure (ENF) test, for characterization under modes I and II, respectively. To study the in-joint behaviour, single lap joints (SLJs) of aluminium and carbon fibre-reinforced polymer (CFRP) were manufactured and tested under different temperatures. Results showed a progressive interfacial failure following adhesive plasticization, allowing deformation prior to failure at 8 MPa. An adhesive failure mode was confirmed through scanning electron microscopy (SEM) analysis of aluminium SLJ. The adhesive exhibits tensile properties comparable to existing adhesives, while demonstrating enhanced lap shear strength and a distinctive failure mechanism. These characteristics suggest potential advantages in applications involving heat and pressure across automotive, electronics and structural bonding sectors.
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