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Interface-Tailored Secondary Excitation and Ultrafast Charge/Energy Transfer in Ti3C2T-MoS2 Heterostructure Films
Jiaxu Zhang1, Rafael Muñoz-Mármol2,3, Shuai Fu1
1Faculty of Chemistry and Food Chemistry & Center for Advancing Electronics Dresden (cfaed), Technische Universität Dresden, 01062 Dresden, Germany.
Researchers discovered a secondary excitation and ultrafast charge transfer in plasmonic (Ti3C2Tx) and semiconducting (MoS2) heterostructures. This work advances the design of advanced optoelectronic and photochemical devices.
Area of Science:
- Materials Science
- Nanotechnology
- Physical Chemistry
Background:
- Efficient charge/energy separation in plasmonic materials is key for photochemical and optoelectronic applications.
- Understanding carrier dynamics in plasmonic-semiconducting heterostructures like MXene-TMDs is crucial but remains challenging.
Purpose of the Study:
- To investigate the mechanisms of plasmon-induced carrier dynamics at Ti3C2Tx-MoS2 interfaces.
- To explore secondary excitation and ultrafast charge/energy transfer phenomena.
- To engineer interfacial thermal transport for enhanced performance.
Main Methods:
- Fabrication of large-scale Ti3C2Tx and MoS2 films via self-assembly techniques.
- Assembly of macroscopic heterostructures with controlled interface sequences.
- Utilized transient absorption and optical pump-terahertz probe spectroscopy.
Main Results:
- Observed a secondary excitation in MoS2 driven by Ti3C2Tx surface plasmon resonance (∼70 ps rise time).
- Demonstrated interfacial thermal transport engineering to extend this time to ∼175 ps.
- Identified sub-150 fs ultrafast charge/energy transfer from Ti3C2Tx to MoS2, boosting MoS2 photoconductivity by up to 180%.
Conclusions:
- Uncovered novel secondary excitation and ultrafast charge transfer mechanisms in Ti3C2Tx-MoS2 heterostructures.
- Highlighted the role of interfacial engineering in manipulating excited-state dynamics.
- Provided critical insights for developing high-performance plasmonic MXene-based heterostructures for advanced applications.
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