Electromagnetic Interference Shielding of a Sequential Dual-Curing Thiol-Epoxy System Reinforced with GNPs with High...

Area of Science:

• Materials Science
• Nanotechnology
• Polymer Chemistry

Background:

• Modern electronics require materials that manage electromagnetic interference (EMI) and heat in confined spaces.
• Simultaneous solutions for EMI and thermal management are needed, utilizing materials with high conductivity.
• Adaptable materials, such as dual-curing epoxy systems, offer potential solutions.

Purpose of the Study:

• To develop and evaluate dual-curing epoxy systems reinforced with graphene nanoplatelets (GNPs).
• To investigate the impact of GNP content on material properties, including EMI shielding and shape-memory performance.
• To demonstrate the multifunctional capabilities of these composites for advanced electronic applications.

Main Methods:

• Synthesis of dual-curing epoxy systems using thiol-epoxy chemistry.
• Reinforcement of epoxy matrices with varying concentrations of graphene nanoplatelets (GNPs).
• Characterization of mechanical properties, shape-memory behavior, and electromagnetic interference (EMI) shielding efficiency.
• Modeling of near-field and far-field EMI shielding for comparison with experimental data.

Main Results:

• Graphene nanoplatelet (GNP) loading significantly enhanced properties.
• Shape-memory fixation and recovery rates remained high, near 99%, even with increased GNP content.
• A maximum electromagnetic interference (EMI) shielding efficiency of 24 dB was achieved with higher GNP concentrations.
• Experimental EMI shielding results aligned well with the developed near-field and far-field models.

Conclusions:

• Dual-curing epoxy composites reinforced with GNPs exhibit excellent multifunctional properties.
• These materials effectively address challenges in EMI shielding and shape-memory applications.
• The developed composites show significant potential for use in advanced electronic devices requiring integrated functionalities.