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Process of Making Three-dimensional Microstructures using Vaporization of a Sacrificial Component
Published on: November 2, 2013
Additive Manufacturing of Vapor Chambers
Kuan-Lin Chen1, Shao-Chi Hsu1, Shung-Wen Kang1
1Department of Mechanical and Electro-Mechanical Engineering, Tamkang University, New Taipei City 25137, Taiwan.
Additive manufacturing (AM) creates advanced vapor chambers (VCs) with triply periodic minimal surface (TPMS) structures. These monolithic VCs significantly reduce thermal resistance for high-performance electronics thermal management.
Area of Science:
- Materials Science
- Mechanical Engineering
- Thermal Management
Background:
- High-performance electronics demand advanced thermal management solutions.
- Traditional vapor chamber (VC) manufacturing has limitations in precision and performance.
- Additive manufacturing (AM) offers a novel approach to fabricating VCs with complex internal structures.
Purpose of the Study:
- To investigate the thermal performance of VCs fabricated using AM with triply periodic minimal surface (TPMS) Gyroid capillary structures.
- To evaluate the impact of different fill ratios and printing orientations on VC thermal performance.
- To demonstrate the benefits of monolithic VC fabrication via AM, eliminating welding.
Main Methods:
- Fabrication of VCs using AM with internal Gyroid TPMS capillary structures at two fill ratios.
- Experimental thermal performance testing under various heat loads.
- Comparison of horizontal and vertical printing techniques for VC manufacturing.
- Analysis of thermal resistance reduction with capillary structures compared to solid structures.
Main Results:
- Higher fill ratio VCs showed enhanced thermal stability under high heat loads.
- Lower fill ratio VCs performed better under low heat loads, reaching 0.3688 K/W thermal resistance at 80 W.
- Vertical printing proved more feasible for mass production and maintained vapor circulation.
- AM-fabricated monolithic VCs achieved a 75% reduction in thermal resistance compared to VCs without capillary structures.
Conclusions:
- AM enables precise fabrication of VCs with integrated TPMS capillary structures for superior thermal management.
- Monolithic construction via AM eliminates welding defects, enhancing reliability and performance.
- Optimized fill ratios and printing strategies are crucial for maximizing VC performance across different thermal loads.
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