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Related Concept Videos

Trends in Lattice Energy: Ion Size and Charge02:54

Trends in Lattice Energy: Ion Size and Charge

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An ionic compound is stable because of the electrostatic attraction between its positive and negative ions. The lattice energy of a compound is a measure of the strength of this attraction. The lattice energy (ΔHlattice) of an ionic compound is defined as the energy required to separate one mole of the solid into its component gaseous ions. For the ionic solid sodium chloride, the lattice energy is the enthalpy change of the process:
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Updated: May 21, 2025

Demonstrating the Simplicity and In Situ Temperature Monitoring of the Mechanochemical Synthesis of Metal Chalcogenides Suitable for Thermoelectrics
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Atomic-scale interface strengthening unlocks efficient and durable Mg-based thermoelectric devices.

Wusheng Zuo1, Hongyi Chen2, Ziyi Yu3

  • 1State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, China.

Nature Materials
|March 18, 2025
PubMed
Summary
This summary is machine-generated.

Researchers developed a new atomic-scale interface for solid-state thermoelectric devices. This innovation enhances stability and efficiency in converting waste heat to electricity, paving the way for more durable thermoelectric modules.

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Area of Science:

  • Materials Science
  • Solid-State Physics
  • Energy Conversion

Background:

  • Solid-state thermoelectric technology offers a promising route for waste heat recovery.
  • Widespread adoption is limited by long-term stability issues at the electrode-thermoelectric material interface.

Purpose of the Study:

  • To engineer an atomic-scale direct bonding interface for enhanced thermoelectric device stability and performance.
  • To investigate the impact of robust chemical bonding on interfacial properties and device efficiency.

Main Methods:

  • Fabrication of MgAgSb/Co thermoelectric junctions utilizing atomic-scale direct bonding.
  • Characterization of interfacial resistivity, bonding strength, and thermal stability at 573 K.
  • Evaluation of thermoelectric module conversion efficiency and long-term durability under thermal cycling.

Main Results:

  • Achieved a low interfacial resistivity of 2.5 µΩ cm² and high bonding strength of 60.6 MPa.
  • Demonstrated high thermal stability of the interface at 573 K.
  • MgAgSb-based modules reached 10.2% conversion efficiency with negligible degradation over 1,440 hours of thermal cycling.

Conclusions:

  • Atomic-scale interface engineering is crucial for advancing thermoelectric semiconductor devices.
  • The developed robust and thermally stable interface significantly improves the efficiency and durability of thermoelectric modules.
  • This work enables more efficient and reliable waste heat to electricity conversion technologies.