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Updated: May 21, 2025

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
Published on: December 7, 2015
Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors
Andrew C Yu1, Tathagata Srimani2,3, Max M Shulaker1,4
1Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Abstract:
Carbon nanotube field-effect transistors (CNFETs) are promising candidates for back-end-of-line logic integration as a complementary path for continued electronic scaling. However, overcoming CNFET ambient drift (i.e., air stability) and reliability is underexplored. Here, we demonstrate that silicon nitride encapsulation limits ambient atmosphere-induced threshold voltage shift (∼8× reduction of median ΔVT over 90 days). With stabilized nitride-encapsulated CNFETs, we characterize CNFET negative bias temperature instability (NBTI) with both DC and AC stress across the electric field, temperature, gate oxide thickness, and stress frequency. AC pulsed operation significantly improves CNFET NBTI vs DC operation across a wide frequency range of 1 kHz-10 MHz. A 20% duty cycle AC operation at 10 MHz could extend the NBTI time to failure by > 104× vs DC for a target |ΔVT| tolerance ≤100 mV with a gate bias VGS,Stress = -1.2 V at 125 °C. This work improves our understanding of overcoming ambient drift and BTI reliability in CNFETs.
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