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Unveiling surface dynamics: in situ oxidation of defective WS2
Daria Kieczka1,2, Fabio Bussolotti2,3, Thathsara D Maddumapatabandi2,3
1Department of Physics and Astronomy and the London Centre for Nanotechnology, University College London, Gower Street, London WC1E 6BT, UK. daria.kieczka.16@ucl.ac.uk.
Defects in transition-metal dichalcogenides (TMDs) like WS2 accelerate oxidation. Lower oxygen pressure slows degradation, while higher pressures increase it, impacting device applications.
Area of Science:
- Materials Science
- Surface Science
- Nanotechnology
Background:
- Transition-metal dichalcogenides (TMDs) are crucial for advanced applications.
- Defects and oxidation in air significantly impact TMD performance.
- Understanding oxidation dynamics is vital for material stability.
Purpose of the Study:
- To investigate the relationship between oxidation dynamics and oxygen availability in defective WS2.
- To elucidate the role of sulfur vacancies in oxidative degradation.
- To provide insights for protecting TMDs in device applications.
Main Methods:
- Inducing sulfur vacancies in WS2 using Ar+ sputtering.
- Studying oxidation under varying O2 pressures (<10-4 mbar and higher).
- Analyzing changes in tungsten (W) oxidation states using X-ray Photoelectron Spectroscopy (XPS).
- Employing Density Functional Theory (DFT) calculations to model reaction mechanisms.
Main Results:
- Oxidation rate is dependent on O2 availability and defect concentration.
- Slow oxidation observed at low O2 pressures (<10-4 mbar) due to limited O2-vacancy interactions.
- Rapid oxidation occurs at higher O2 pressures, evidenced by W oxidation state changes.
- DFT calculations confirm experimental findings and reveal O2 dissociation mechanisms on S vacancy clusters.
Conclusions:
- Sulfur vacancies significantly enhance WS2 susceptibility to oxidation.
- Oxygen pressure is a critical factor controlling oxidation kinetics.
- Reaction barriers for O2 dissociation are influenced by the coordination of surface W atoms.
- Findings offer guidance for mitigating degradation in TMD-based devices.
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