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Updated: May 20, 2025

Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors
Published on: November 24, 2016
Gallium Nitride High Electron Mobility Transistor Device with Integrated On-Chip Array Junction Temperature
Yukuan Chang1, Yue Su1, Mingke Xiao1
1School of Intelligent Science and Technology, Hangzhou Institute for Advanced Study, University of Chinese Academy of Sciences, Hangzhou 310024, China.
Abstract:
Herein, we present a novel method for junction temperature monitoring of GaN HEMT devices to achieve real-time temperature perception at different locations on the device surface. Through sputtering patterned Ti/Pt thermistor strips on the surface of a GaN HEMT device to construct an on-chip array junction temperature monitoring unit, the thermal distribution of the device during operation is fully reflected. The developed temperature monitoring unit exhibited a desirable temperature coefficient of resistance of 0.183%/°C in the range of 25 °C to 205 °C. Comparison with the thermal imager shows that the integrated temperature monitoring unit can accurately reflect the real-time temperature with a monitoring accuracy of more than 95%, which helps to improve the long-term reliability of GaN power devices under actual application conditions of high frequency and high power density.
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