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Up to 182 GBd PAM-4 optical interconnects eliminating receiver-side equalization DSP
Optics Letters
|April 1, 2025
Summary
This study introduces a thin-film lithium niobate modulator for optical interconnects, significantly reducing power consumption and latency. It achieves high data rates with error correction thresholds, enhancing performance for AI clusters and computing networks.
Area of Science:
- Photonics and Optical Communications
- Integrated Photonics
- High-Speed Data Transmission
Background:
- Artificial intelligence (AI) clusters and computing networks require low-power, low-latency optical interconnects for effective scaling.
- Traditional intensity modulation with direct detection (IM/DD) optical interconnects heavily depend on digital signal processing (DSP), increasing power consumption and latency.
Purpose of the Study:
- To compare the performance of linear receive optics (LRO) against fully DSP solutions using a broadband thin-film lithium niobate (TFLN) Mach-Zehnder modulator (MZM) chip.
- To demonstrate reduced power consumption and latency in optical interconnects by minimizing receiver-side DSP.
Main Methods:
- Utilized a broadband thin-film lithium niobate (TFLN) Mach-Zehnder modulator (MZM) chip.
- Compared performance metrics between LRO and fully DSP-based optical interconnect solutions.
- Evaluated bit-error rates (BERs) against forward error correction (FEC) thresholds.
Main Results:
- Achieved generation of 154 GBd PAM4 and 190 GBd OOK signals with BERs below the KP4-FEC threshold.
- Successfully transmitted 182 GBd PAM4 over 150m of single-mode fiber.
- Generated a 196 GBd OOK signal with BER below the 20% soft-decision forward error correction (SD-FEC) threshold, eliminating receiver-side equalization DSP.
Conclusions:
- The TFLN MZM chip enables optical interconnects with drastically reduced power consumption and latency.
- Eliminating receiver-side equalization DSP while maintaining high-bandwidth performance ensures broad interoperability for future computing networks.
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