Oxide-dispersion-enabled laser additive manufacturing of high-resolution copper.

Area of Science:

• Materials Science
• Additive Manufacturing
• Nanotechnology

Background:

• Laser additive manufacturing of pure copper (Cu) is crucial for microelectronics and telecommunications.
• Achieving high resolution in 3D-printed Cu remains a significant challenge.
• Existing methods struggle to produce complex, high-resolution Cu components.

Purpose of the Study:

• To develop a facile oxide-dispersion-strengthening (ODS) strategy for high-resolution Cu additive manufacturing.
• To enable the production of pure Cu components with sub-100 μm resolution using laser powder-bed fusion.
• To enhance the mechanical and functional properties of additively manufactured Cu.

Main Methods:

• Introduced ultrafine Cu2O nanoparticles into pure Cu powder feedstock via oxygen-assisted gas atomisation.
• Utilized laser powder-bed fusion for additive manufacturing of the ODS Cu.
• Characterized the microstructure, mechanical properties, and electrical conductivity of the ODS Cu.

Main Results:

• Achieved additive manufacturing of Cu with sub-100 μm (~70 μm) resolution.
• Nanoscale Cu2O dispersoids improved laser absorptivity, melt viscosity, and dynamic wetting.
• ODS Cu exhibited a yield strength of ~450 MPa and uniform elongation of ~12% while retaining high electrical conductivity.
• Demonstrated a 2.5-fold improvement in signal intensity for an ODS Cu micro-architected terahertz antenna compared to traditional 3D-printed Cu antennas.

Conclusions:

• The ODS strategy is effective for high-resolution additive manufacturing of pure Cu.
• This approach significantly enhances the mechanical strength and functional performance of 3D-printed Cu components.
• The developed ODS Cu is suitable for advanced applications in microelectronics, telecommunications, and terahertz devices.