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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
In Situ Transfer of Laser-Induced Graphene Electronics for Multifunctional Smart Windows
Tongmei Jing1,2, Han Ku Nam2, Dongwook Yang2
1College of Control Science and Engineering China University of Petroleum (East China) Qingdao 266555 China.
Abstract:
The ascent of internet of things (IoT) technology has increased the demand for glass electronics. However, the production of glass electronics necessitates complicated processes, including conductive materials coating and chemical vapor deposition, which entail the use of additional chemicals. Consequently, this raises environmental apprehensions concerning chemical and electronic waste. In this study, a fast, cost-effective, and simple approach are presented to meet the growing demand for glass electronics while addressing environmental concerns associated with their production processes. The method involves converting polyimide (PI) tape into laser-induced graphene (LIG) and transferring it onto a glass substrate using ultraviolet laser direct writing technology. This process allows for the fabrication of LIG-embedded glass without additional chemical treatments in ambient air. Subsequently, the residual PI tape is removed, resulting in LIG-based glass electrodes with an electrical resistivity of 1.065 × 10-3 Ω m. These LIG electrodes demonstrate efficient functionality for window applications such as defogging, heating, temperature sensing, and solar warming, suitable for automotive and residential windows. The potential scalability of this eco-friendly technology to IoT-based smart and sustainable window electronics further underscores its adaptability to meet diverse user needs.

