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THRU-REFLECT Method for Scattering Parameter Extraction from Back-to-Back Measurements of Waveguide Components.
Songyuan Xu1, Jiwon Heo1, Chan-Soo Lee1
1School of Electric and Computer Engineering, Chungbuk National University, Cheongju 28644, Republic of Korea.
Sensors (Basel, Switzerland)
|April 12, 2025
Summary
This study introduces a straightforward method for extracting scattering parameters of waveguide components using back-to-back measurements. The technique simplifies device characterization, requiring fewer connections and providing accurate results for component design.
Area of Science:
- Electrical Engineering
- Electromagnetics
- Microwave Engineering
Background:
- Waveguide component design verification often relies on back-to-back measurements of paired units.
- Extracting individual device characteristics from these measurements is challenging.
Purpose of the Study:
- To present a simple method for extracting scattering parameters of individual waveguide components.
- To enable accurate characterization from back-to-back measurements.
Main Methods:
- Utilizes back-to-back measurements with minimal waveguide mating connections.
- Employs one reflection measurement with an offset SHORT and two transmission measurements with a THRU configuration.
- Derives a singular condition in S-parameter extraction equations to determine optimal standard lengths.
Main Results:
- A novel method for extracting scattering parameters (S-parameters) of waveguide components is proposed.
- The method simplifies the measurement process, requiring only three connections.
- Numerical simulations demonstrate the effectiveness of the method for a broadband coax-to-waveguide transition.
Conclusions:
- The proposed method offers a simplified and effective approach to waveguide component characterization.
- Accurate S-parameter extraction is achievable from back-to-back measurements.
- This technique aids in the design and verification of new waveguide components.

