Improving high temperature resilience of fiber sensor embedded smart components through laser shock peening

This study explores the use of laser shock peening (LSP) to enhance material properties and high-temperature performance of fiber-sensor-fused smart parts fabricated by additive manufacturing (AM) methods. Using embedded fiber sensors as distributed strain gauges, the study demonstrates that LSP can induce compressive strains of up to 130 µε on fiber embedded 1-mm below metal surfaces. The electron backscatter diffraction (EBSD) analysis shows that, with optimized LSP parameters, the metallic matrix undergoes substantial microstructural refinement, resulting in denser structures. Thermal cycling tests showed that the LSP process can increase fiber slippage temperatures by more than 50 ^oC. This work shows that the LSP process is an effective room-temperature process for enhancing both surface quality and increasing fiber slippage threshold under both thermal and mechanical stress.