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Synchronously Enhancing Through-Plane Thermal Conductivity and Near-Field Electromagnetic Interference Shielding
Shengqiang Zhang1,2, Yong Wang1, Fukang Deng1
1Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China.
Small (Weinheim an Der Bergstrasse, Germany)
|April 14, 2025
Summary
New composites using vertically aligned graphite (VG) with nickel coating (Ni@G) and silicone gel (SG) offer excellent thermal conductivity and electromagnetic interference (EMI) shielding for electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Advanced microelectronic packaging requires materials with both thermal conductivity and electromagnetic interference (EMI) shielding.
- Graphite flakes are promising for these applications due to their electrical and thermal properties, but their inherent anisotropy limits performance.
- Addressing graphite's anisotropy is crucial for effective heat dissipation and electromagnetic compatibility in electronic devices.
Purpose of the Study:
- To develop novel composites that overcome the limitations of anisotropic graphite for thermal and EMI shielding applications.
- To fabricate vertically aligned graphite (VG), nickel-coated graphite (Ni@G), and silicone gel (SG) composites (VG-Ni@G-SG).
- To evaluate the thermal conductivity, EMI shielding effectiveness, and mechanical properties of the developed composites.
Main Methods:
- Fabrication of VG-Ni@G-SG composites using shear-induced alignment and ultrasonic cutting technology.
- Characterization of through-plane thermal conductivity using standard methods.
- Measurement of near-field shielding effectiveness (NF-SE) across a frequency range of 500 MHz-7 GHz.
- Assessment of compression modulus to determine mechanical properties.
Main Results:
- The VG-Ni@G-SG composites achieved a high through-plane thermal conductivity of 15.8 W m-1 K-1.
- Near-field shielding effectiveness (NF-SE) reached -68 dB within the 500 MHz-7 GHz frequency range.
- A low compression modulus of 0.6 MPa was observed, beneficial for electronic packaging.
Conclusions:
- The developed VG-Ni@G-SG composites effectively integrate high thermal conductivity and EMI shielding capabilities.
- These materials address the challenges posed by anisotropic graphite, offering improved performance in electronic applications.
- The composites show significant potential for the miniaturization and enhanced performance of modern electronic devices.
