A Novel Method of Adding Sucrose in Fixed Abrasive Pads for Self-Conditioning

A method of self-conditioning a fixed abrasive pad via the dissolution of sugar in bonds was proposed. Self-conditioning means that pads can be dressed by themselves during lapping processing. Self-conditioning experiments were conducted on a series of sucrose resin-based fixed abrasive pads for the lapping of monocrystalline silicon wafers. The material removal rate (MRR), pad wear rate (PWR), machined three-dimensional surface roughness (S _a), and pad surface topography were measured during lapping experiments. Different self-conditioning rates were realized by regulating the dissolution rate of sucrose in the pad. The maximum MRR reached 18.99 nm/min, and the minimum S _a value achieved after machining decreased from original 409.8 nm to 64.3 nm. The self-conditioning mechanism of a sucrose-resin-based fixed abrasive pad was illustrated. The microstructure evolution and abrasive wear process on the pad surface under different self-conditioning rates are discussed in detail using a schematic diagram.