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Directly Probing Thermal Transport Across Micrometer-Thick Metallic Interfaces Using Transient Thermal Grating
Jinghang Dai1, Samuel Kielar1, Jiyoung Kim1
1Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY, 14853, USA.
Small Methods
|April 24, 2025
Summary
A new laser-induced transient thermal gratings (TTG) spectroscopy method effectively probes thermal interface properties in microelectronics. This technique resolves thermal conductivity for thin interfaces, aiding the design of advanced thermal management solutions.
Area of Science:
- Materials Science
- Thermal Engineering
- Microelectronics
Background:
- Miniaturization and increased power density in microelectronics necessitate advanced thermal management.
- Interfacial thermal resistance significantly impacts heat dissipation in electronic devices.
- Current methods lack direct probing capabilities for interface thermal properties.
Purpose of the Study:
- To introduce a novel method for investigating thermal interface properties.
- To establish structure-property relationships for various die-attach methods.
- To enable better thermal interface design for high-performance microelectronics.
Main Methods:
- Laser-induced transient thermal gratings (TTG) spectroscopy was employed.
- The technique was applied to analyze soldered interfaces.
- Thermal conductivity was resolved for specific bond line thicknesses (55 and 11 µm).
Main Results:
- Demonstrated the capability of TTG spectroscopy to measure thermal conductivity of thin interfaces.
- Successfully resolved thermal conductivity for different bond line thicknesses.
- Identified structure-property relationships for interfaces created by different die-attach methods.
Conclusions:
- TTG spectroscopy is a powerful and convenient method for probing interface thermal properties.
- The technique facilitates the identification of interface quality.
- This advancement benefits the design of microelectronic devices with improved thermal management and lower contact resistance.
