Resultant Incidence Angle: A Unique Criterion for Controlling the Inclined Columnar Nanostructure of Metallic Films

The original Glancing Angle Deposition (GLAD) technique was developed using the evaporation process, i.e., in high vacuum, with a nearly punctual source, and with the substrate aligned with the source axis. In this specific case, the substrate tilt angle can be assumed to be equal to the impinging incidence angle of evaporated atoms. With the sputtering process, the deposition pressure is higher, sources are larger, and substrates are not intrinsically aligned with the source. As a result, deviations from the growth models applied for evaporation are reported, and the substrate tilt angle is no longer relevant for describing the impinging atomic flux. To control the inclined nanostructure of metallic films, a relevant description of the atomic flux is required, applicable across all deposition configurations. In this work, transport simulation is used to determine the resultant incidence angle, a unique criterion relevant to each specific deposition condition. The different representations of the flux are described and discussed, and some typical examples of the resultant angles are presented. Ten elements are investigated: three hcp transition metals (Ti, Zr, and Hf), six bcc transition metals (V, Nb, Ta, Cr, Mo, and W), and one fcc post-transition metal (Al).