Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Microcracking in Concrete01:20

Microcracking in Concrete

87
Microcracking in concrete refers to the tiny cracks that can form within the material even before any external load is applied. These microcracks typically occur at the interface between the coarse aggregate and the hydrated cement paste, often as a result of differential volume changes prompted by variations in stress-strain behavior, as well as thermal and moisture movement. Initially, these microcracks remain stable and do not grow substantially until the concrete is stressed to about 30...
87
Fatigue01:21

Fatigue

166
Fatigue occurs when materials rupture under repeated or fluctuating loads, even at stress levels far below their static breaking strength. It typically results in brittle failure, even for ductile materials. It is a critical consideration in designing machines and structural components subjected to repetitive or varying loads. The nature of these loadings can range from fluctuating loads like unbalanced pump impellers causing vibrations to repeatedly bending a thin steel rod wire back and forth...
166

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Early planting and early maturing sunflower hybrids are neglected management tools to remedy outbreaks of the red sunflower seed weevil (Coleoptera: Curculionidae).

Environmental entomology·2026
Same author

PARP4 ADP-ribosylates PIDD1 to complete a phospho/SUMO/PAR-ylation cascade that orchestrates PIDDosome assembly.

Science advances·2026
Same author

Systemic effects of metabolic acidosis.

Clinical nephrology·2026
Same author

Long-term efficacy of chlorhexidine-containing cutaneous dressings on ventriculostomy-related infection: a 10-year before-and-after study.

Neurosurgical focus·2025
Same author

Modeling the Effect of Microbially Induced Calcium Carbonate Precipitation (MICP) on CO<sub>2</sub> Trapping.

Environmental science & technology·2025
Same author

Repeats mimic pathogen-associated patterns across a vast evolutionary landscape.

Cell genomics·2025

Related Experiment Video

Updated: May 10, 2025

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics
13:58

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics

Published on: September 28, 2016

11.6K

An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations.

Wei Yu1, Faxing Che1, Vance Liu2

  • 1Micron Semiconductor Asia Operations Pte. Ltd., 990, Bendemeer Road, Singapore 339942, Singapore.

Micromachines
|April 26, 2025
PubMed
Summary

This study analyzes copper trace cracks in memory packages, identifying failure modes and propagation paths. Enhanced solder resist (SR) significantly improves reliability by reducing stress and strain during temperature cycling tests (TCTs).

Keywords:
copper foilcopper trace crackfinite element analysis (FEA)material characterizationreliability testing

More Related Videos

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices
09:26

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Published on: June 26, 2015

8.7K
Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
07:00

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

14.9K

Related Experiment Videos

Last Updated: May 10, 2025

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics
13:58

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics

Published on: September 28, 2016

11.6K
In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices
09:26

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Published on: June 26, 2015

8.7K
Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
07:00

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Published on: March 20, 2019

14.9K

Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Semiconductor Packaging

Background:

  • High input/output demands in memory packages necessitate precise trace dimensions, challenging current designs.
  • Substrate copper trace cracks are a critical reliability concern during temperature cycling tests (TCTs).

Purpose of the Study:

  • To analyze copper trace crack mechanisms in memory packages.
  • To identify common failure modes, initiation sites, and propagation paths.
  • To evaluate the impact of material properties and design parameters on reliability.

Main Methods:

  • Experimental observations and material characterization (including nanoindentation and stress-strain testing).
  • Numerical simulations using finite element (FE) models.
  • Design of Experiments (DOE) to assess solder resist (SR) performance.

Main Results:

  • Higher E/H values in copper foil correlated with lower failure rates.
  • FE simulations accurately predicted trace crack locations.
  • Variations in trace width and material properties showed significant differences in plastic strain (up to 40% and 30%).
  • High-strength SR reduced stress and strain by up to 75%.

Conclusions:

  • Solder resist (SR) plays a crucial role in copper trace reliability.
  • SR failure significantly increases plastic strain accumulation, highlighting the need for robust SR materials and designs.
  • Understanding crack mechanisms and material properties is key to improving memory package reliability.