Non-Invasive Wide-Field Imaging of Chip Surface Temperature Distribution Based on Ensemble Diamond Nitrogen-Vacancy...

Area of Science:

• Quantum sensing and metrology
• Solid-state physics and materials science
• Nanotechnology and microelectronics

Background:

• Growing demand for electronic device reliability necessitates advanced temperature monitoring.
• Nitrogen-vacancy (NV) centers in diamond offer high-sensitivity temperature measurement capabilities.
• NV center sensitivity is influenced by both temperature and magnetic fields, requiring careful system design.

Purpose of the Study:

• To analyze the impact of magnetic fields on NV center-based temperature detection.
• To develop a high-sensitivity, wide-field temperature measurement system for electronic chips.
• To demonstrate non-contact, 2D temperature imaging of chip surfaces under varying current conditions.

Main Methods:

• Utilized optically detected magnetic resonance (ODMR) wide-field imaging platform.
• Employed a temperature-sensitive structure with ensemble diamond on a quartz substrate.
• Integrated a CCD camera for imaging, achieving a 500 μm² field of view and 1.3 μm spatial resolution.

Main Results:

• Achieved high-sensitivity temperature detection with a sensitivity of approximately 10 mK/Hz^1/2.
• Demonstrated wide-field imaging capabilities with a large field of view and high spatial resolution.
• Successfully mapped the 2D temperature distribution on a chip surface under different current loads.

Conclusions:

• The developed NV center system provides effective wide-field, non-contact, and high-speed temperature imaging.
• This technology is suitable for assessing the thermal performance and reliability of electronic chips.
• The study highlights the potential of quantum sensing for advanced microelectronic thermal management.