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Thin Film Composite Silicon Elastomers for Cell Culture and Skin Applications: Manufacturing and Characterization

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Published on: July 3, 2018

Heat Resistant Poly(carborane-siloxane) Adhesives.

Chongwen Yu^1,2, Xuejie Wang^1,3, Jiaqi Sun¹

¹Zhejiang Key Laboratory of Data-Driven High-Safety Energy Materials and Applications, Ningbo Key Laboratory of Special Energy Materials and Chemistry, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.

Macromolecular Rapid Communications

|April 30, 2025

Summary

New vinyl-functionalized poly(carborane-siloxane) (PCS) adhesives offer superior thermal stability and adhesion for harsh environments. These high-temperature adhesives overcome limitations of traditional organic materials, showing promise for aerospace and demanding applications.

Keywords:

ablation resistant carborane high‐temperature adhesive polysiloxane

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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

Published on: July 3, 2020

Area of Science:

Materials Science
Polymer Chemistry
Adhesion Science

Background:

Organic adhesives are widely used but fail at high temperatures due to oxidation and degradation.
Harsh environments, such as in aerospace, require adhesives with enhanced thermal stability and robust performance.
Existing organic adhesives lack the necessary resilience for extreme temperature applications.

Purpose of the Study:

To develop novel high-temperature adhesives with improved thermal stability and adhesion.
To synthesize and characterize vinyl-functionalized poly(carborane-siloxane) (PCS) based adhesives.
To investigate the effect of crosslinking density on the thermal and mechanical properties of PCS adhesives.

Main Methods:

Synthesis of vinyl-functionalized PCS (PCS-x%) via a one-pot method.
Crosslinking of PCS-x% using 2,5-Dimethyl-2,5-di(tert-butylperoxy)hexane to form c-PCS-x% adhesives.
Evaluation of thermal stability (weight loss), adhesion strength at various temperatures, and post-aging performance.

Main Results:

All synthesized c-PCS-x% adhesives exhibited good thermal stability with <10% weight loss.
c-PCS-75% showed the lowest weight loss (3.6%), attributed to suppressed borane volatilization and increased cohesive energy.
c-PCS-x% adhesives demonstrated superior adhesion strength compared to linear analogs up to 250 °C.
c-PCS-25% maintained 5.68 MPa adhesion strength after aging at 200 °C/24 h and passed a 10-min ablation test with a 1 kg load.

Conclusions:

Topology-controlled poly(carborane-siloxane) networks provide a novel molecular design for high-temperature adhesives.
The developed adhesives exhibit excellent thermal stability and adhesion, overcoming limitations of conventional organic adhesives.
These advanced materials are suitable for demanding applications in harsh environments, including aerospace.