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Transitory germinative excision repair in Bacillus subtilis.

T C Wang, C S Rupert

    Journal of Bacteriology
    |March 1, 1977
    PubMed
    Summary
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    Bacillus subtilis strains deficient in DNA repair genes show high UV sensitivity. Germinative excision repair, a transient process, partially restores UV resistance in germinated spores by removing DNA dimers.

    Area of Science:

    • Microbiology
    • Molecular Biology
    • Genetics

    Background:

    • Bacillus subtilis strains UVSSP-42-1 and UVSSP-1-1 exhibit sensitivity to ultraviolet (UV) radiation in both dormant spore and vegetative cell stages.
    • These strains possess defects in DNA repair mechanisms, specifically the excision of cyclobutane-type dimers and the removal of spore photoproducts.

    Purpose of the Study:

    • To investigate the DNA repair capabilities of Bacillus subtilis strains with specific genetic mutations affecting UV resistance.
    • To characterize the process of germinative excision repair and its role in UV resistance during spore germination.

    Main Methods:

    • Comparative analysis of DNA repair in Bacillus subtilis strains UVSSP-42-1 (hcr42 ssp1) and UVSSP-1-1 (hcr1 ssp1) under UV irradiation.
    • Assessment of DNA repair mechanisms, including dimer excision and spore photoproduct removal, at different life cycle stages (dormant spores, vegetative cells, germinated spores).

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  • Evaluation of the impact of the recA1 mutation on UV sensitivity and germinative excision repair.

    • Main Results:

    • Mutant strains are deficient in removing cyclobutane-type dimers from vegetative cell DNA and spore photoproducts from spore DNA.
    • Germinated spores of these strains exhibit transient germinative excision repair, capable of removing dimers but not spore photoproducts.
    • Germinative excision repair confers significant UV resistance to germinated spores and enables temporary host cell reactivation of irradiated phages.
    • The recA1 mutation increases UV sensitivity in germinated spores but does not impede dimer removal via germinative excision repair.

    Conclusions:

    • Germinative excision repair is a crucial, albeit transient, DNA repair pathway in Bacillus subtilis germination, providing temporary UV resistance.
    • The hcr and ssp1 genes play distinct roles in DNA repair, with hcr involved in dimer excision and ssp1 in spore photoproduct removal.
    • Understanding these repair mechanisms is vital for comprehending bacterial survival strategies against DNA damage.