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Updated: May 14, 2025

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
Published on: May 2, 2016
Zero-Power consumption based evaporative cooling for rated current conduction in SiC mosfets
Kuo-Bin Hong1, Shivendra Kumar Singh2,3, Chen Sung4
1Semiconductor Research Center, Hon Hai Research Institute, Taipei, Taiwan.
Abstract:
This work demonstrates a highly efficient, zero-power-consumption evaporative cooling system for managing heat generated by SiC MOSFETs operating near their current capacity. The system employs capillary-driven water transport through cotton ropes to an aluminum heatsink, where cellulose paper spreads the water for even evaporation. The process effectively lowers the junction temperature (Tj) of the MOSFETs, monitored in real-time using the correlation between its on-resistance (RON) and Tj. Evaporative cooling dissipates 42% of total heat without a fan and 89% with a fan. COMSOL simulations are performed and can closely match experimental data, highlighting that optimizing heat transfer between the lead frame and heatsink and increasing the cooling fin height are the keys to further improve the evaporative cooling efficiency. This study offers a sustainable and efficient cooling solution for high-power SiC MOSFETs, reducing reliance on energy-intensive cooling systems and demonstrating potential scalability for industrial applications.
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