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Updated: May 22, 2025

Growth and Electrostatic/chemical Properties of Metal/LaAlO3/SrTiO3 Heterostructures
Published on: February 8, 2018
Two-dimensional n/p type carriers at the interface of LaAlO3/KTaO3 heterostructures
Yirong Geng1, Zuhui Hu1, Chang Liu1
1Physics Department, Materials Genome Institute, Shanghai Engineering Research Center for Integrated Circuits and Advanced Display Materials, Institute for Quantum Science and Technology, International Centre of Quantum and Molecular Structures, Shanghai University, Shanghai, 200444, China. renwei@shu.edu.cn.
Abstract:
This study employs first-principles calculations to investigate the behavior of two-dimensional carriers at the interfaces and surfaces of polar/polar LaAlO3/KTaO3 (LAO/KTO) heterostructures. Unlike traditional LaAlO3/SrTiO3 (LAO/STO) polar/nonpolar heterostructures with LaAlO3 unit-cell thickness-dependent critical conductive behavior, the LaAlO3/KTaO3 heterostructures are demonstrated to have intrinsic two-dimensional carriers with carrier concentrations reaching up to 1014 cm-2, significantly higher than those observed in LaAlO3/SrTiO3 systems. Furthermore, in contrast to traditional sandwich heterostructure models, the single-interface LaAlO3/KTaO3 heterostructures exhibit no bandgap dependence on the LaAlO3 thickness. These phenomena arise from the bipolar characteristics of the LaAlO3/KTaO3 system, and it can introduce increased carrier density and reduce symmetry within the single-interface polar heterostructure. Simulation results also show that applying in-plane strain can suppress and even reverse the n/p-type of two-dimensional carriers at the interfaces. Additionally, the presence of oxygen vacancies enhances carrier accumulation by redistributing the internal polarization field of the heterostructures. Overall, this research offers a comprehensive elucidation of the behaviors and formation mechanisms for n/p-type two-dimensional carriers in polar/polar LaAlO3/KTaO3 heterostructures and provides potential strategies for manipulating these two-dimensional carriers in relevant materials and devices.
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