Chemically crosslinked flexible polymer phase change material with self-healing, self-adaptive, and shape-memory...

Area of Science:

• Materials Science
• Nanotechnology
• Chemical Engineering

Background:

• Effective heat dissipation is critical for high-efficiency operation of electronic components.
• Phase change materials (PCMs) are promising for thermal management but often suffer from leakage issues.
• Developing advanced thermal interface materials (TIMs) is essential to overcome these limitations.

Purpose of the Study:

• To develop a novel Thermal Interface Phase Change Material (TIPCM) with enhanced thermal conductivity and structural integrity.
• To address the leakage problem associated with traditional PCMs.
• To improve the thermal management capabilities of electronic components.

Main Methods:

• Melt blending paraffin wax (PW) with styrene-ethylene-butylene-styrene (SEBS) and incorporating dicumyl peroxide as a crosslinking agent.
• Forming a crosslinked PW-SEBS network to maintain structural integrity above PW's melting point.
• Incorporating Boron Nitride (BN) as a thermally conductive filler.

Main Results:

• The TIPCM maintained structural integrity above the melting temperature of PW, preventing leakage.
• The material exhibited self-healing capabilities up to 70% of its original state.
• Addition of BN increased thermal conductivity by 348.14%, with a tensile break elongation rate of 129.1%.

Conclusions:

• The developed TIPCM offers a robust solution for thermal management in electronic devices.
• Its unique properties, including leakage prevention, self-healing, high thermal conductivity, and flexibility, make it suitable for demanding applications.
• The TIPCM significantly reduces chip temperatures, providing a new avenue for advanced thermal management solutions.