A High-Temperature-Resistant and Conductive Flexible Silicone Rubber with High Phenyl Content Based on Silver-Coated...

To enhance the high-temperature resistance of silicone rubber and meet the application requirements of flexible conductive silicone rubber under elevated temperature conditions, this study adopts a chemical modification strategy by introducing phenyl groups into the molecular chains of silicone rubber to improve its thermal resistance. High-phenyl-content hydroxyl-terminated silicone oil (MPPS) was used as the polymer backbone, and vinylmethyldimethoxysilane (VDMS) served as the chain extender. Through a silanol condensation reaction, vinylmethylphenyl polysiloxane (VMPPS) with a crosslinkable structure was synthesized, providing reactive sites for subsequent vulcanization and molding. Subsequently, needle-like silver-coated glass fiber (AGF) conductive fillers were prepared via a green and environmentally friendly electroless silver plating method. These fillers were incorporated into the phenyl polysiloxane matrix to impart electrical conductivity to the phenyl silicone rubber while synergistically enhancing its thermal resistance. Finally, thermally resistant conductive silicone rubber was fabricated through high-temperature vulcanization, and the key properties of the material were systematically characterized. The synthesized phenyl polysiloxane exhibited a number-averaged molecular weight of up to 181,136, with a PDI of 2.43. When the loading of AGF reached 25 phr, the phenyl silicone rubber composite achieved the electrical percolation threshold, exhibiting a conductivity of 7.12 S/cm. With a further increase in AGF content to 35 phr, the composite demonstrated excellent thermal stability, with a 5% weight loss temperature of 478 °C and a residual mass of 37.36% at 800 °C. Moreover, after thermal aging at 100 °C for 72 h, the conductivity degradation of the phenyl silicone rubber was significantly lower than that of commercial silicone rubber, indicating outstanding electrical stability. This study provides an effective approach for the application of flexible electronic materials under extreme thermal environments.