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Updated: May 20, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Fang Hu1, Xiang Xiang Fang1, Chuang Yue1,2
1Department of Microelectronics Science and Engineering, School of Physical Science and Technology, Ningbo University, Ningbo, 315211, China.
Three-dimensional silicon wafer-based microenergy devices offer enhanced capacity and power for microelectronic systems. These 3D architectures improve energy density and electrochemical kinetics for next-generation smart devices.
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