Simple Protein Foaming-Derived 3D Segregated MgO Networks in Epoxy Composites with Outstanding Thermal Conductivity...

Area of Science:

• Materials Science
• Nanotechnology
• Chemical Engineering

Background:

• Miniaturization and high-power density in electronics necessitate advanced thermal management solutions.
• Current thermal interface materials (TIMs) face limitations in heat dissipation efficiency due to low thermal conductivity.
• Effective heat transfer in electrically insulating packaging is crucial for device performance and longevity.

Purpose of the Study:

• To fabricate MgO-based composites with enhanced thermal conductivity for efficient heat dissipation.
• To optimize the microstructure of TIMs for improved heat transfer pathways in electronic packaging.
• To investigate the thermal and electrical properties of novel MgO-based composites.

Main Methods:

• Utilized a protein foaming method to create interconnected ceramic-filler networks in MgO-based composites.
• Optimized the heat-transfer path within the composite material.
• Investigated the effect of sintering-induced liquid phase on MgO-epoxy matrix bonding.

Main Results:

• Achieved a high thermal conductivity of 17.19 W m^-1 K^-1 in composites with 54.64 vol% MgO, a 101-fold increase over pure epoxy.
• Demonstrated thermal conductivity 3.7 times higher than randomly dispersed composites and superior to nitride-based composites.
• Exhibited a low thermal-expansion coefficient (27.76 ppm °C^-1) and high electrical-insulation strength (51.51 kV mm^-1).

Conclusions:

• The developed MgO-based composites offer excellent thermal performance for electronic packaging.
• The protein foaming method and optimized microstructure effectively enhance heat dissipation.
• These materials provide a promising solution for efficient thermal management in integrated electronics.