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Debonding-on-demand adhesives for recycling and reusing of electronic devices
Daewhan Kim1, Youngjoo Park1, Min Sang Kwon1
1Department of Material Science and Engineering, Research Institute of Advanced Materials, Seoul National University, Seoul 08826, Republic of Korea. minsang@snu.ac.kr.
Abstract:
Electronic waste (e-waste) is one of the fastest-growing waste streams, largely due to surging demand for devices like smartphones, tablets, and laptops. While e-waste contains valuable resources, its disposal also involves hazardous components that threaten human health and the environment. A critical barrier to effective recycling is the adhesives used in device assembly, which complicate disassembly and reduce material recovery. Recent research has explored diverse residue-free and efficient debonding methods. Notably, irreversible photo-debondable adhesives show particular promise by enabling precise, controlled, and on-demand release without damaging sensitive components. Moving forward, developing adhesives that incorporate both debonding capabilities and degradability will be essential for achieving efficient, sustainable recycling and minimizing the environmental impact of e-waste.
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