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Versatile Liquid Metal Composite Inks for Printable, Durable, and Ultra-Stretchable Electronics.

Jeongsu Pyeon1, Hyeonseung Lee2, Wonho Choe2

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Summary

A new liquid metal composite particle (LMCP) ink overcomes printing challenges for flexible electronics. This self-sintering ink enables high-performance, stretchable electrodes and metamaterial absorbers via advanced printing techniques.

Keywords:
durabilityliquid metal composite inkmetamaterial absorberprintingself‐sinteringstretchability

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Liquid metal (LM) possesses excellent properties for stretchable and flexible electronics.
  • Challenges like high surface tension and poor wettability hinder commercial printing of liquid metals.

Purpose of the Study:

  • To develop a self-sintering liquid metal composite particle (LMCP) ink for printable electronics.
  • To overcome the limitations of liquid metal inks in commercial printing processes.

Main Methods:

  • Created LMCP ink with tunable surface tension, viscosity, and wettability using polyvinylpyrrolidone (PVP)-capped liquid metal particles (LMPs) and Laponite.
  • Achieved uniform, coffee-ring-free deposition via solutal-Marangoni-driven mixing and particle settling under ambient conditions.
  • Developed a co-self-assembly process for LMCPs to promote self-sintering.

Main Results:

  • The LMCP ink demonstrates coffee-ring-free, crack-free, and post-processing-free deposition.
  • Resulting electrodes exhibit over 1200% stretchability and maintain electrical conductivity.
  • The printed electrodes show stability for nearly one year in air and can be patterned into complex configurations.

Conclusions:

  • The developed LMCP ink is suitable for commercial printing of stretchable and flexible electronic devices.
  • LMCPs show potential for applications in advanced printable electronics, such as stretchable metamaterial absorbers.
  • This innovation facilitates the widespread adoption of liquid metal in next-generation electronic applications.