Soluble Photosensitive Polyimide Precursor with Bisphenol A Framework: Synthesis and Characterization.

Area of Science:

• Polymer Chemistry
• Materials Science
• Organic Synthesis

Background:

• Polyimide films are crucial in electronics and aerospace due to their thermal stability and mechanical strength.
• Developing photosensitive polyimides with tunable mechanical properties remains a key challenge.
• Soluble precursors offer advantages in processing and film formation.

Purpose of the Study:

• To synthesize a soluble photosensitive polyamide ester precursor (BAFPAE).
• To create transparent photosensitive polyimide films with enhanced mechanical properties.
• To investigate the impact of reaction parameters on film characteristics.

Main Methods:

• Copolymerization of 2,2-bis [4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP) and 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA).
• Incorporation of hydroxyethyl methacrylate (HEMA) for photosensitivity.
• Thermal curing of precursor films to form polyimide films.
• Systematic investigation of reaction temperature and HEMA equivalents on mechanical properties.

Main Results:

• Successful synthesis of a soluble photosensitive polyamide ester precursor (BAFPAE).
• Formation of transparent photosensitive polyimide films with interpenetrating polymer networks (IPNs).
• Optimized BAF-x-y film achieved high toughness (12.69 MJ m³), Young's modulus (2.86 GPa), elongation at break (21.16%), and tensile strength (92.68 MPa).

Conclusions:

• The formation of polyacrylate-polyimide IPNs is critical for maintaining mechanical integrity.
• The developed photosensitive polyimide exhibits excellent mechanical properties.
• This material holds potential for applications requiring transparent, mechanically robust, and photosensitive films.