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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Enhanced thermal conductivity of distributed face-cooled composite laser medium included thermal resistance at the
Abstract:
A new concept of the effective thermal conductivity (κeff) of the laser gain medium with the distributed face-cooled composite synthesized by the inter-layer surface activated bonding (il-SAB) has been proposed. The thermal resistances at the bonded interface (R) between 1at.% Nd:YAG and a c-cut sapphire single crystal in several composites were experimentally confirmed and it was found that il-SAB brings negligibly small R. On the contrary, R in the bi-layer composite of 1at.% Nd:YAG and sapphire sandwiching indium foil fabricated by 6.0-kN uniaxial pressing reached 1.4 × 10-5 m2K/W at 25°C. In the case of the simple contact of 1at.% Nd:YAG and a sapphire single crystal, R at 25°C was 4.3 × 10-4 m2K/W. Consequently, effective thermal conductivities in bi-layered composites with 1at.% Nd:YAG and c-cut sapphire with the same thickness fabricated by il-SAB, sandwiching indium foil, and simple contacting without bonding were evaluated to be 15.3 W/mK, 13.9 W/mK, and 3.65 W/mK, respectively. Negligible R of composite gain media by il-SAB indicates that κeff of 1at.% Nd:YAG will be improved from 10 W/mK to more than 30 W/mK if sapphire parts are thicker than 12.2 times of YAG parts in composite gain media with the distributed face-cooling structure.

