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Full-field strain measurements on medical devices using digital image correlation: Considerations and practical
Taylor M Rothermel1, Hadi Mirmohammad1, Jason D Weaver1
1Division of Applied Mechanics, Office of Science and Engineering Laboratories, Center for Devices and Radiological Health, U.S. FDA, Silver Spring, MD, USA.
Summary
This study explores optical digital image correlation (DIC) for measuring strains on medical devices. High-pressure airbrushing and graphite powder/microstamping yield optimal speckle patterns for accurate strain analysis.
Area of Science:
- Biomedical Engineering
- Materials Science
- Optical Metrology
Background:
- Direct stress and strain measurements are crucial for implantable medical device development.
- Current methods for acquiring such data on medical devices are limited.
- Optical Digital Image Correlation (DIC) offers a potential solution for full-field strain characterization.
Purpose of the Study:
- To investigate the feasibility of using optical DIC for strain measurement on medical devices.
- To evaluate various speckle pattern application techniques for DIC analysis.
- To demonstrate DIC's capability in revealing material behavior under load.
Main Methods:
- Investigated multiple speckle pattern application methods: aerosol painting, transfer papers, airbrushing (low/high pressure), graphite powder deposition, and microstamping.
- Performed comparative studies to assess speckle pattern quality at different scales (millimeter and sub-millimeter).
- Applied full-field DIC to measure strains on nitinol components (wire, Z-specimens, stent rings) under bending loads.
Main Results:
- High-pressure airbrushing produced superior millimeter-scale speckle patterns.
- Monodisperse graphite powder and microstamping yielded optimal sub-millimeter scale patterns.
- DIC successfully identified Lüders-like phase transformation bands in nitinol under bending.
Conclusions:
- Optical DIC is a feasible technique for direct strain measurement on medical devices across various scales.
- Specific speckling methods are optimal for different field-of-view requirements.
- This technique provides valuable data for device design, durability assessment, and computational modeling.

