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Published on: November 16, 2018
High-Performance GaN/BAs Heterojunctions: Dual Functionality of BAs for Enhanced Electrical and Thermal Management in
Shenglin Lu1,2, Yujun Chen2, Ao Shi2
1School of Materials Science and Engineering, State Key Laboratory of Optoelectronic Materials and Technologies, Sun Yat-sen University, Guangzhou, 510006, China.
Cubic boron arsenide (BAs) integration with gallium nitride (GaN) via surface-activated bonding yields high-performance heterojunctions. This advancement offers superior electrical and thermal properties for next-generation power electronics.
Area of Science:
- Materials Science
- Semiconductor Physics
Background:
- Cubic boron arsenide (BAs) exhibits exceptional thermal and electrical properties, making it attractive for advanced electronic and optoelectronic devices.
- Challenges in BAs growth conditions hinder its integration into functional devices.
Purpose of the Study:
- To fabricate high-quality gallium nitride/BAs (GaN/BAs) heterojunctions.
- To evaluate the electrical and thermal performance of these heterojunctions.
- To explore the potential of BAs in next-generation power electronics.
Main Methods:
- Fabrication of GaN/BAs heterojunctions using surface-activated bonding.
- Atomic characterization to analyze interface quality and layer thickness.
- Performance testing of rectification ratio and thermal dissipation.
Main Results:
- Achieved high-quality GaN/BAs interfaces with a rectification ratio exceeding 107.
- Optimal performance observed at intermediate layer thicknesses below 20 nm.
- BAs demonstrated superior heat dissipation compared to GaN alone.
Conclusions:
- Surface-activated bonding enables high-quality GaN/BAs heterojunctions.
- BAs serves as both an active p-type semiconductor and an efficient cooling substrate.
- BAs integration is promising for advanced power electronics requiring excellent electrical and thermal management.
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