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Published on: May 17, 2024
Interfacial chemical bond engineering on a Te semiconductor to weaken carrier-phonon coupling to boost thermoelectric
Decheng An1, Min Liu1, Zhiyong Si1
1College of Chemistry and Chemical Engineering, State Key Laboratory of Clean and Efficient Coal Utilization, Taiyuan University of Technology, Taiyuan 030024, China. andecheng@tyut.edu.cn.
Abstract:
The thermoelectric performance of Te-based semiconductors can be boosted by utilizing interfacial chemical-bonding heterogeneity without doping the matrix lattice. The dual p-p type heterointerfaces obtained through introducing metavalently bonded Bi2Te3 and covalently bonded B into Te enable obvious carrier-phonon decoupling.
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