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Temperature-activated coupling effect of nano-Ag coupled ultrasonic transducer during heating process
Yiqing Gu1, Mingyuan Wang1, Jiuhong Jia1
1Key Laboratory of Pressure Systems and Safety, Ministry of Education, East China University of Science and Technology, Shanghai 200237, China.
None:
High-temperature ultrasonic transducers (HTUTs) are critical for structural health monitoring (SHM). While many existing studies on HTUTs prioritize maximizing operational temperatures or focus on singular high-performance piezoelectric materials or robust bonding techniques like brazing for extreme conditions, this work distinguishes itself by comprehensively investigating a synergistic, multi-component system specifically optimized for stable, well-characterized performance and revealing novel interfacial phenomena within the industrially prevalent 350 °C range. We introduce a HTUT innovatively constructed using a nano-Ag coupling layer, graphite conductive glue for reliable electrical contacts, and mica high-temperature wire. The transducer's performance and underlying mechanisms are systematically assessed from 20 °C to 350 °C. Results demonstrate exceptional high-temperature adaptability with stable echo characteristics. A primary distinguishing contribution is the identification and characterization of a "Temperature-Activated Coupling Effect". Unlike the monotonic performance degradation often anticipated or observed with increasing temperature in many systems, the Temperature-Activated Coupling Effect reveals a unique window where peak-to-peak voltage and SNR are enhanced after surpassing a specific thermal threshold. This phenomenon, attributed to thermally induced improvements at the nano-Ag coupling interface, offers novel insights for optimizing transducer performance. While the mechanical coupling coefficient showed a complex trend, peaking at 100 °C, the overall significance of this study lies in its holistic design approach and the elucidation of the Temperature-Activated Coupling Effect, offering a practical and mechanistically insightful advancement beyond simply achieving temperature tolerance. This provides a distinct pathway for developing HTUTs with tailored performance enhancements for moderately high-temperature SHM applications, contrasting with approaches solely focused on ultimate temperature limits or single-material improvements.
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