Optimization and Experimental Analysis of Electroless Nickel Plating on the Diamond Surface

Area of Science:

• Materials Science
• Surface Engineering
• Tribology

Background:

• Diamond particles are crucial for pre-grinding tools, but their bonding strength with substrates limits performance.
• High-temperature resistant nickel coatings enhance diamond particle bonding, improving tool stability, lifespan, and efficiency.

Purpose of the Study:

• To explore and optimize the electroless nickel plating process on diamond surfaces.
• To investigate palladium-free activation solutions for improved nickel plating on diamonds.
• To determine the optimal conditions for electroless nickel plating to enhance diamond-substrate bonding.

Main Methods:

• Investigated palladium-free activation using silver nitrate (AgNO3) solutions, including AgNO3 with ammonia (NH3·H2O).
• Employed orthogonal and single-factor experimental designs to study plating parameters.
• Analyzed the effects of ammonia concentration, sodium hypophosphite concentration, plating temperature, and diamond particle size.

Main Results:

• Silver nitrate solutions are feasible activators for electroless nickel plating on diamond surfaces.
• A solution of 2 g/L AgNO3 + 10 mL/L NH3·H2O yielded a higher surface plating ratio.
• Optimal plating conditions identified: 17.5 mL/L ammonia, 33 g/L sodium hypophosphite, and 80 °C.
• Achieved a 10.75% surface plating ratio on 120/140 mesh diamond particles under optimal conditions.

Conclusions:

• Electroless nickel plating with optimized palladium-free activation significantly enhances diamond particle bonding.
• The developed process improves the high-temperature stability and performance of pre-grinding tools.
• This method offers a viable strategy for manufacturing advanced, high-performance grinding tools.