Microstructure and Property Evolution of Pure Copper Under Asynchronous Rolling

This study investigates the impact of asynchronous rolling on the microstructure, tensile properties, and electrical conductivity of pure copper. Pure copper sheets were subjected to asynchronous rolling with asynchronous ratios of 1.0 and 1.2, followed by microstructural analysis using electron backscatter diffraction, tensile testing, and resistivity measurements. Notable increases in ultimate tensile strength and yield strength were observed, with the sample processed at an asynchronous ratio of 1.2 showing improvements of 25.8% in tensile strength and 3.42% in yield strength compared to the sample processed at an asynchronous ratio of 1. However, an increase in strain localization and a decrease in elongation were noted, indicating a trade-off between strength and ductility. Furthermore, conductivity measurements revealed that the increase in asynchronous ratio led to a rise in defect density, resulting in a 19.96% decrease in conductivity. These findings provide valuable insights into optimizing asynchronous rolling parameters to tailor the performance of pure copper in various industrial applications.